The follow-on to the famed capability of the BondaScope 2100, the BondaScope 3100 re-defines the meaning of “Full Featured” and “Multi-Mode” Composite Bond Tester. The unit is housed in a larger, rugged aluminium case and features a high speed, 5.7” dia. QVGA, Hi-Bright, EL display featuring NDT Systems “X-or” Digital Phosphor, true persistence control.
In addition, the BondaScope 3100 incorporates all the features above including Resonance Impedance Plane Mode, adding an adjustable, Hi-Energy fixed frequency Mechanical Impedance Analysis Mode (MIA) as well as a Swept Frequency MIA (SweepMI) Mode bringing the MIA mode to a more useful and interpretive purpose. Specific to the BondaScope 3100 is the High-Energy, Swept Frequency Pitch-Catch Mode.
- High Bright EL Display.
- RF Impedance Plane Mode.
- High Speed Swept Frequency.
- 100 Setups 250 Images Storage.
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