The ThermoScope system offers unprecedented performance in a compact unit designed for field applications.  Developed under a US Navy SBIR to streamline the thermographic inspection process for field applications, ThermoScope’s lightweight and portable design allows rapid set-up and operation by a single operator. 

A dedicated user interface at the inspection head allows a single operator to inspect large components and make on the spot decisions.  Simple push-button controls and programmed inspection features make it easy for an NDT technician to use with minimal training.  Using powerful built-in processing algorithms, ThermoScope provides high quality inspection data using low-cost, uncooled IR cameras.

For more information visit: www.thermalwave.com



NEW BondaScope Series, Ultrasonic Bond Testers

BondaScope 300:

Is a simple to operate Ultrasonic Bond Tester incorporating a frequency adjustable Pitch-Catch mode only. It features a tunable Tone Burst as well as a high energy spike pulse for those absorbent or other difficult materials. This unit may be simple to use, but the real features lie beneath the surface. Three simple direct access keys set the desired operational mode from RF Phase Bond Profile, RF Amplitude Bond Profile and our exclusive Bond "Signature" mode. Other features include phase and/or amplitude alarm gating with a high dB audio alarm. In addition, there is a high level password protection scheme also. Display is 3.9" Diag. LCD and is FULLY SUNLIGHT readable, Quarter VGA (240x320). Size 7.25" Tall x 3.5" Wide x 1.87" Thick and 1.8lbs (with all batteries installed). The unit operates on 3 or 6 'AA' NiMH or alkaline batteries for up to 10 hours.

BondaScope 350:

A step up from the BondaScope 300 in features as well as capability all in a ruggedized, hand held instrument (size and weight as above). In addition to the adjustable Pitch-Catch Mode, the BondaScope features an Resonance Impedance Plane mode as well as a Swept Frequency Pitch-Catch mode. Better than 70% of applications fall into the capabilities of the BondaScope 350.

BondaScope 3100:

FINALLY, the follow on to the famed capability of the BondaScope 2100, the BondaScope 3100 Re-Defines the meaning of "Full-Featured" and "Multi-Mode" Composite Bond Tester Housed in a larger ruggedized aluminum case featuring a High Speed, 5.7" Diag. QVGA, Hi-Bright, EL Display featuring our "X-or" Digital Phosphor, true persistance control... not simply a screen clear.

In addition the BondaScope 3100 incorporates all of the features above including the Resonance Impedance Plane Mode, adding an adjustable, Hi-Energy fixed frequency Mechanical Impedance Analysis Mode (MIA) as well as a Swept Frequency MIA (SweepMI) Mode bringing the MIA mode to a more useful and interpretive purpose.
Another mode specific to the BondaScope 3100 is the High-Energy, Swept Frequency Pitch-Catch Mode. The modes above can be presented in NDT Systems exclusive Real Time, Bond Profile Mode. Dimensions of the BondaScope 3100 are 8.9" Tall x 5.75" Wide x 2.45 Deep and operates up to 9 hours on one Li-Ion Smart Battery Pack. Probes connect via an 11 pin Fischer Connector and are available from NDT Systems incorporating our Probe Recognition Technology (simplifying initial setups) or use probes of other manufacture directly, if desired potentially offering a significant savings in total cost of ownership.

For more information visit: www.ndtsystems.com